pk6 8 2 (v1.0) oct 31 , 2014 www.xilinx.com 1 pk 68 2 ( v1.0 ) oct 31 , 201 4 100% material declaration data sheet for zynq? - 7000 rb484 package average weight: 5.5549 g component substance description cas number or description percentage of component use in product component weight/ substance weight (grams) component percent of total silicon die 0.156648 2.820% silicon 7440- 21- 3 100.00 basis 0.156648 solder bump 0.007775 0.140% tin 7440- 31- 5 63.00 basis 0.004898 lead 7439- 92- 1 37.00 basis 0.002877 underfill 0.027300 0.491% bisphenol f/ epichlorohydrin 9003- 36- 5 20.00 basis 0.005460 phenolic resin trade secret 15.00 basis 0.004095 bisphenol a type liquid epoxy resin 25068- 38- 6 5.00 basis 0.001365 amine type accelerator trade secret 5.00 basis 0.001365 silicon dioxide 60676- 86- 0 51.50 basis 0.014060 carbon black 1333- 86- 4 1.00 basis 0.000273 additives trade secret 2.50 additive 0.000683 solder paste 0.004664 0.084% tin 7440- 31- 5 63.00 metal 0.002938 lead 7439- 92- 1 37.00 metal 0.001726 capacitor 1 0.000600 0.011% barium 12047- 27- 7 71.29 ceramic 0.000428 manganese 1313- 13- 9 10.43 ceramic 0.000063 nickel 7440- 02- 0 2.00 internal electrode 0.000012 copper 7440- 50- 8 11.57 termination 0.000069 glass oxide 65997- 17- 3 0.21 termination 0.000001 nickel 7440- 02- 0 1.80 plating 0.000011 gold 7440- 57- 5 2.70 plating 0.000016 ? copyright 2014 xilinx, inc. xilinx, the xilinx logo, virtex, spartan, ise, and other designated brands included herein are trademarks of xil inx in the united states and other countries. all other trademarks are the property of their respective owners
100% material declaration data sheet for zynq? - 7000 rb484 package pk68 2 (v1.0) oct 31 , 2014 www.xilinx.com 2 component substanc e description cas number or description percentage of component use in product component weight/ substance weight (grams) component percent of total capacitor 2 0.004650 0.084% barium 12047- 27- 7 72.40 ceramic 0.003367 manganese 1313- 13- 9 10.60 ceramic 0.000493 nickel 7440- 02- 0 4.00 internal electrode 0.000186 copper 7440- 50- 8 5.80 termination 0.00027 glass oxide 65997- 17- 3 0.20 termination 0.000009 nickel 7440- 02- 0 2.66 plating 0.000124 tin 7440- 31- 5 3.99 plating 0.000186 lead 7439- 92- 1 0.35 plating 0.000016 capacitor 3 0.014400 0.259% barium 12047- 27- 7 88.86 ceramic 0.012795 manganese 1313- 13- 9 1.43 ceramic 0.000206 nickel 7440- 02- 0 4.29 internal electrode 0.000617 copper 7440- 50- 8 0.7 0 termination 0.000101 glass oxide 65997- 17- 3 0.01 termination 0.000002 nickel 7440- 02- 0 3.57 plating 0.000514 tin 7440- 31- 5 0.9 0 plating 0.00013 lead 7439- 92- 1 0.24 plating 0.000035 heat sink 3.464000 62.359% copper 7440- 50- 8 97.94 main material 3.392642 nickel 8049- 31- 8 2.06 main material 0.071358 heat sink adhesive 0.057200 1.030% aluminium oxide al203 1344- 28- 1 70.00 main material 0.040040 dimethyl siloxane, dimethylvinyl - terminated 68083- 19- 2 30.00 main material 0.017160 solder ball 0.460670 8.293% tin 7440- 31- 5 63.00 main material 0.290222 lead 7439- 92- 1 37.00 main material 0.170448 substrate 1.357000 24.429% copper 7440- 50- 8 36.77 0.498997 tin 7440- 31- 5 0.81 0.010962 lead 7439- 92- 1 0.47 0.006438 bt core trade secret 48.22 0.654317 abf trade secret 11.26 0.152754 solder mask trade secret 2.47 0.033531
100% material declaration data sheet for zynq? - 7000 rb484 package pk68 2 (v1.0) oct 31 , 2014 www.xilinx.com 3 revision history the following table shows the revision history for this document. notice of disclaimer xilinx regards this materials data to be correct but makes no guarantee as to its accuracy or completeness, including, but not limited to, with respect to its compliance with applicable environmental laws and regulations. xilinx subcontracts the production, test and assembly of hardware devices to independent third - party vendors and materials suppliers (?contractors?). all data provided hereunder is based on inf ormation received from contractors. xilinx has not independently verified the accuracy or completeness of this information which is provided solely for your reference in connection with the use of xilinx products . date version description of revisions 10/31 /2014 1.0 xilinx initial release
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